About Us
描述
描述
About Us
Inxun Technology Co., Ltd., located in Zhuhai, China, is an innovation-driven high-tech company expertise in silicon photonic integrated chip and compound semiconductor laser technology.
We have mastered advanced CMOS silicon photonics and photonic integrated circuit (PIC) technologies. Built on proprietary intellectual property and vertically integrated technologies, we provide comprehensive end-to-end chip development capabilities spanning silicon photonics and III-V chip design, tape-out, integration, packaging, and testing.
Our products include silicon photonics-based core optoelectronic devices, integrated modules, and subsystems. Through innovative technological solutions, we provide core technological support for a wide range of high-value emerging applications, including AI data centers, CPO/OCS, precision measurement, next-generation optical sensing, FMCW LiDAR, medical photonics, and quantum photonics. Our products have already been deployed at scale by leading industry customers in domestic and international markets.
Core Business
Core Technology
  • Silicon Photonic Integrated Chip Technology
  • Tunable Photonics Technology
  • III-V Laser Chip Technology
Company Team
  • The company's core technical team is composed of chip experts from top chip companies in Silicon Valley and elite talents from international high-tech enterprises, and is one of the few hard technology teams in the world that has mastered the core technology of silicon photonic integrated chips and compound semiconductor laser chips. The team leader is a national overseas high-level talent, who has worked in the top silicon photonics enterprises in Silicon Valley for many years, has more than 40 invention patents and published more than 20 papers and monographs, and has led the creation of the first domestic silicon photonics integrated chip R&D and industrialization platform. The team has strong photonic integrated chip technology accumulation and continuous innovation ability, with industry-leading experience in silicon photonic chip design, manufacturing and packaging process, as well as experience in the design and production of optoelectronic hybrid integrated systems, and has completed the whole process of more than ten optoelectronic chip products from design to prototype to mass production. Master key production processes and core software and hardware technologies such as complex chip design, optoelectronic packaging and core device design, optoelectronic system development, and control algorithms.
Awards & Certifications
Company Timeline
Join Us
Inxuntech is a hard-tech company specializing in silicon photonics chips and high-end optical devices, with business focused on cutting-edge fields such as data centers, CPO, precision industrial measurement, and optical sensing. The company’s core team brings together top talents from the chip and high-tech industries both in China and overseas, with expertise spanning both silicon photonics and compound semiconductor laser chip technologies.
Here, you will have the opportunity to deeply participate in core R&D projects, collaborate on solving challenging technical problems, and achieve both personal growth and technological breakthroughs. The company embraces a culture of innovation, pragmatism, and flat organizational management, offering clear career development paths, competitive compensation packages, year-end and equity incentives, comprehensive benefits, and strong employee support programs.
We warmly welcome talented professionals in optoelectronics, chips, semiconductors, algorithms, hardware, and related fields to join us. Please send your resume to:hr@inxuntech.com, You may also upload your resume directly.
描述
  • Job title
    Address
    Benefits
  • Optoelectronic Control Development Manager
    Zhuhai
    discuss personally
    Responsibilities:
    1. Lead the development, testing, prototype production and debugging of control and driving circuits of related optoelectronic devices of FMCW lidar products;
    2. Responsible for the design and optimization of semiconductor laser (array) driving and control circuits, including laser ultra-low noise driving circuits, temperature compensation circuits, low-noise amplification circuits, and MHz modulation circuits;
    3. Responsible for the design and optimization of detection circuits of silicon photonics APD and SiPM detectors, including amplification and noise reduction. APD, SiPMT, pixel, CMOS sensor control driver chip selection and design introduction;
    4. responsible for DOE design verification and measurement, and optical engineers together for module and subsystem verification. Write and manage appropriate design documentation.
    Requirements:
    1. Bachelor's or master's degree in electronics, information, precision instrument, automatic control, communication or related majors, more than 8 years of relevant work experience;
    2. Proficient in analog circuit design, analog signal processing and control, weak signal low-noise amplification and closed-loop temperature control circuit design; familiar with EMI, small signal electromagnetic shielding, noise interference treatment, etc.;
    3. Experience in ultra-low noise drive circuit, low noise PCB board design, FPGA, DSP, ADC/DAC and PCB layout;
    4. Experience in embedded system design, proficient in the application development of common interfaces/protocols: RS2332, SPI, I2C, etc.; proficient in the programming application of common analog/digital chips;
    5. Familiar with MATLAB or MATHCAD, have certain experience in firmware development (C++);
    6. Experience in successfully completing the design and development of optoelectronic modules or subsystems;
    7. Experience in project and team management is preferred.
    Address:
    Zhuhai
    Deadline:
    No deadline
  • Chip Design Integration Engineer
    Zhuhai
    Face to face discussion
    Responsibilities:
    1. Proficient in or familiar with the simulation design of photonic devices and large-scale silicon photonics integrated chips, responsible for DOE, formulating test plans and design validation;
    2. Leading the layout and design of chip masks, coordinating chip tape-out of external chip foundries;
    3. Leading and coordinating internal departments to complete the chip post-process and device packaging;
    4. Guiding the testing and verification of chips and devices, conducting yield analysis, and coordinating the process improvement of foundry.
    Requirements:
    1. Master's degree or above in optics, electrical engineering, experimental physics, etc.;
    2. Experience in the design and design process integration of photonic chips such as SOI, InP, SOS, etc.;
    3. Familiar with the use of simulation tools such as Lumerical, Beamprop/FullWave, PhotonDesign, etc., with an emphasis on DfM;
    4. Experience in CMOS silicon photonics design and MPW foundry, understand the main stream process and manufacturing process,
    5. Use JMP or MiniTab analysis software,
    6. Experience in mask layout tools L-edit, Klayout, DW2000, etc.
    Address:
    Zhuhai
    Deadline:
    No deadline
Please upload your resume. We will contact you as soon as possible after receiving it.
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